TECHNOLOGYMethod for Re-metallizing Aluminum and Aluminum Alloy Bond Pads
Overview
The present invention is a method for re-metallizing the bond pads of electronic chips which are metallized with aluminum or aluminum alloys such as Al/Si/Cu. Unlike most existing techniques, the invention does not sacrifice wire bondability. The invention is a sequence of electrochemical treatments which selectively covers the chip bond pads with gold, which is both wire bondable and flip chip bondable.The invention is available for immediate application. It can also be used for the re-metallization of singulated dies and full wafers. Further, it can be applied to various aluminum alloys and can use platinum or palladium rather than gold.
For additional information please contact the Office of Technology Commercialization, University of Maryland, College Park, MD 20742. Phone (301) 405-3947. E-mail: [email protected].
Contact Info
UM Ventures
0134 Lee Building
7809 Regents Drive
College Park, MD 20742
Email: [email protected]
Phone: (301) 405-3947 | Fax: (301) 314-9502